At present, there are several processes for cyanide copper plating, copper sulfate plating and pyrophosphate copper plating.

Cyanide copper plating process

Cyanide copper plating is the earliest and most widely used copper plating process. The plating solution is mainly composed of a copper cyanide complex and a certain amount of free cyanide, and is strongly alkaline. Since cyanide has a strong ability to activate and complex, the first feature of this plating method is that the solution has a certain degreasing and activation ability. Secondly, since the plating solution uses a cyanide having a strong complexing ability, the complex ions are not easily discharged, so that the bath has a high cathodic polarization and excellent throwing power and covering ability.

Sulfate copper plating process

The sulphate copper plating process was applied to plastic plating, electroforming, finishing, etc., including decorative layers and functional coatings. Earlier applications in the electronics industry were printed circuits, printed boards, and electronic contact components.

Pyrophosphate copper plating process

The composition of the pyrophosphate copper plating solution is simple, the solution is stable, the current efficiency is high, the dispersing ability and the covering ability are good, the plating layer is fine crystallized, and a thick coating layer can be obtained, and the process range can be wide, non-toxic, no It is necessary to evacuate and add a brightener to obtain a semi-bright coating.

Cyanide-free copper plating process

Can completely replace the traditional cyanide copper plating process and bright copper plating process, suitable for any metal substrate: pure copper bismuth copper alloy 丶 丶 丶 stainless steel 丶 zinc alloy die-casting parts, aluminum-bismuth aluminum alloy workpieces and other substrates, hanging plating or Barrel plating can be used.